貝樂實(shí)業(yè)公司成立于2002年，是一家專業(yè)的技術(shù)型存儲(chǔ)集成電路芯片 代理，分銷，現(xiàn)貨供應(yīng)商，凱芯 來(lái)?yè)P(yáng) 旺宏 華邦 鎂光 三星 海力士 南亞 .....國(guó)際品牌，為客戶提供產(chǎn)品，技術(shù)，應(yīng)用，數(shù)據(jù)，資金等服務(wù)，聚焦工業(yè)電子，汽車電子，計(jì)算機(jī)產(chǎn)業(yè)，網(wǎng)絡(luò)通訊，人工智能，安防物聯(lián)市場(chǎng)領(lǐng)域，20年的沉淀積累，貝樂實(shí)業(yè)堅(jiān)持"專業(yè)誠(chéng)信，永續(xù)經(jīng)營(yíng)“的理念，全力保障客戶元器件供應(yīng)鏈的穩(wěn)定，助力上下游合作伙伴發(fā)展壯大。
優(yōu)勢(shì)服務(wù)：
1 大量現(xiàn)貨庫(kù)存，可以快速滿足客戶的生產(chǎn)需求，緩解客戶庫(kù)存壓力。
2 深圳香港均有倉(cāng)庫(kù)可以交貨
3 提供技術(shù) 資金 賬期等服務(wù) 緩解客戶資金壓力
4 二十年存儲(chǔ)銷售經(jīng)驗(yàn)，只做全新原裝正品。原廠代理渠道
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| 料號(hào) | 版本 | 容量 | 工作電壓 | 接口 | 封裝尺寸 | 工作溫度 | 生產(chǎn)狀態(tài) |
| KLMDG2RCTE-B041 | eMMC 5.1 | 128 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | Sample |
| KLMCG2UCTB-B041 | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | Mass Production |
| KLMDG4UCTB-B041 | eMMC 5.1 | 128 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C | Mass Production |
| KLM4G1FETE-B041 | eMMC 5.1 | 4 GB | 1.8 / 3.3 V | HS400 | 11 x 10 x 0.8 mm | -25 ~ 85 °C | Mass Production |
| KLM8G1GEUF-B04P | eMMC 5.1 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLM8G1GEUF-B04Q | eMMC 5.1 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLMAG2GEUF-B04P | eMMC 5.1 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLMAG2GEUF-B04Q | eMMC 5.1 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLMBG4GEUF-B04P | eMMC 5.1 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLMBG4GEUF-B04Q | eMMC 5.1 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLMCG2KCTA-B041 | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | EOL |
| KLMCG2UCTA-B041 | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | EOL |
| KLMDG4UCTA-B041 | eMMC 5.1 | 128 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C | EOL |
| KLMEG8UCTA-B041 | eMMC 5.1 | 256 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C | EOL |
| KLM8G1GESD-B03P | eMMC 5.0 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLM8G1GESD-B03Q | eMMC 5.0 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLM8G1GESD-B04P | eMMC 5.1 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLM8G1GESD-B04Q | eMMC 5.1 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLM8G1GETF-B041 | eMMC 5.1 | 8 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | Mass Production |
| KLMAG1JETD-B041 | eMMC 5.1 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | Mass Production |
| KLMAG2GESD-B03P | eMMC 5.0 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLMAG2GESD-B03Q | eMMC 5.0 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLMAG2GESD-B04P | eMMC 5.1 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 85 °C | Mass Production |
| KLMAG2GESD-B04Q | eMMC 5.1 | 16 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -40 ~ 105 °C | Mass Production |
| KLMBG2JETD-B041 | eMMC 5.1 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 0.8 mm | -25 ~ 85 °C | Mass Production |
| KLMBG4GESD-B03P | eMMC 5.0 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C | Mass Production |
| KLMBG4GESD-B03Q | eMMC 5.0 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 105 °C | Mass Production |
| KLMBG4GESD-B04P | eMMC 5.1 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C | Mass Production |
| KLMBG4GESD-B04Q | eMMC 5.1 | 32 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C | Mass Production |
| KLMCG4JETD-B041 | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -25 ~ 85 °C | Mass Production |
| KLMCG4JEUD-B04P | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 85 °C | Mass Production |
| KLMCG4JEUD-B04Q | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 105 °C | Mass Production |
| KLMCG8GESD-B03P | eMMC 5.0 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C | Mass Production |
| KLMCG8GESD-B03Q | eMMC 5.0 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 105 °C | Mass Production |
| KLMCG8GESD-B04P | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 85 °C | Mass Production |
| KLMCG8GESD-B04Q | eMMC 5.1 | 64 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.0 mm | -40 ~ 105 °C | Mass Production |
| KLMDG8JEUD-B04P | eMMC 5.1 | 128 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 85 °C | Mass Production |
| KLMDG8JEUD-B04Q | eMMC 5.1 | 128 GB | 1.8 / 3.3 V | HS400 | 11.5 x 13 x 1.2 mm | -40 ~ 105 °C | Mass Production |
